Z6尊龙凯时

A national high-tech enterprise specializing in the research and development, production, and sales of light-emitting diode products
Z6·尊龙凯时「中国」官方网站
XL-HD3535IRC-A4
Z6·尊龙凯时「中国」官方网站
XL-HD3535IRC-A4

The XL-HD3535IRC-A4 is a high-power infrared LED in a 3535 package (3.5×3.5×2.2mm) with a peak wavelength of 940nm (near-infrared, completely invisible). It features a colorless transparent silicone lens and an aluminum oxide ceramic substrate, offering excellent heat dissipation. This device is a 3W-class power infrared LED, with a maximum continuous operating current of 0.7A and a radiant intensity of up to 700mW/Sr (typical). It has a 120° beam angle (dome design for both focus and coverage). Suitable for SMT reflow soldering, compliant with ROHS environmental standards, and with a moisture sensitivity level of MSL 3, it's an ideal light source for infrared remote controls, surveillance cameras, industrial control, and photoelectric switches. The 940nm wavelength produces no visible red glow (invisible to the human eye and most cameras), making it perfect for covert infrared lighting scenarios.

Z6·尊龙凯时「中国」官方网站
PDF EDA Model
Product Characteristics

Optical Performance:

Peak Wavelength (λp): 940nm (near-infrared, completely invisible light, no red glow)

Radiant Intensity (Ie): 500~750mW/Sr (@350mA, typical 700mW/Sr, see datasheet for binning)

Viewing Angle (2θ1/2): 120° (dome design, balances directionality and coverage)


Electrical Parameters (Ta=25℃):

Power Consumption (Pd): 3W (high-power type)

Maximum Continuous Forward Current (IF): 0.7A

Forward Pulse Current (IFP): 2.8A (suitable for pulse driving)

Forward Voltage (VF): 2.5~2.9V (@350mA, typical 2.7V, higher than 850nm version’s 1.5V)

Reverse Current (IR): ≤10μA (VR=5V)

Thermal Resistance (Rth j-s): 9℃/W (junction to solder point, excellent heat dissipation)


Structure and Reliability:

Alumina Ceramic Substrate: provides excellent thermal conductivity and insulation

Dome Silicone Encapsulation: increases light output efficiency and protects the chip

Operating Temperature: -35℃ ~ 85℃

Storage Temperature: -40℃ ~ 85℃

Soldering Conditions: Reflow soldering 260℃ ≤ 6s

Passed 1000-hour lifetime test, high temperature and humidity, temperature cycling, and other reliability tests (see page 7 of the datasheet)

Supports radiant intensity and voltage binning for easier batch selection consistency


Others:

EIA standard tape & reel packaging, suitable for high-speed SMT mounting

Moisture-proof and anti-static sealed packaging; recommended to use within 7 days after opening

Product Application

Medical Devices: Infrared sensing, blood oxygen detection, and other functions in medical instruments.


Infrared Remote Controls: Long-distance control, smart home control (940nm is the mainstream wavelength for remotes).


Surveillance Cameras: Night vision lighting, infrared illumination (no red glare, strong concealment).


Industrial Control: Counters, thermal imaging, smart meters.


Infrared Photoelectric Switches: Object detection, position sensing, light barriers.


Wireless Communication and Signal Transmission: Infrared communication links.


Smart Cars/Robots: Obstacle avoidance, line following, distance detection.

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